4.8 Article

Fabrication of thermoplastic polyurethane composites with a high dielectric constant and thermal conductivity using a hybrid filler of CNT@BaTiO3

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MATERIALS TODAY CHEMISTRY
卷 27, 期 -, 页码 -

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ELSEVIER SCI LTD
DOI: 10.1016/j.mtchem.2022.101287

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Melt-extrusion; Polymer Composites; Thermo-mechanical property; Energy Storage

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Thermoplastic polyurethane composites with excellent dielectric constant and high thermal conductivity are successfully prepared using CNT@BaTiO3 as a filler through low-speed melt extrusion method. Proper surface modification of filler particles ensures their complete dispersion in the thermoplastic polyurethane matrix. The prepared composite exhibits improved thermal stability, mechanical properties, thermal conductivity, and dielectric properties compared to the neat thermoplastic polyurethane matrix.
Thermoplastic polyurethane composites with an excellent dielectric constant and high thermal con-ductivity were obtained using CNT@BaTiO3 as a filler through a low-speed melt extrusion method. Before preparing the hybrid filler for the composite, the filler particles were surface modified to ensure that the outer surfaces could facilitate the reaction among particles to form the hybrid and ensure complete dispersion in the thermoplastic polyurethane matrix. After confirming the proper surface treatment of the filler particles using infrared spectroscopy, thermal degradation analysis and field emission scanning electron microscopy, they were used to prepare the composite materials at a processing temperature of 200 degrees C. The thermal stability, thermomechanical properties, mechanical properties, thermal conductivity, and dielectric properties of the composites were investigated. Compared to the neat thermoplastic polyurethane matrix, the prepared composite exhibited a higher thermal stability, approximately 300% higher storage modulus, higher tensile strength and elongation at break values, approximately three times higher thermal conductivity (improved from 0.19 W/(m.K) to 0.38 W/(m.K), and approximately five times larger dielectric constant at high frequencies (at 1 MHz a dielectric constant of 19.2 was obtained).(c) 2022 Elsevier Ltd. All rights reserved.

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