Modifications in the physical structure of a new two-layer micro-size heat sink with sinusoidal shaped cavities for heat transfer augmentation of nanofluid flow

This paper presents numerical simulation of graphe nanoplatelet (GNP) - sodium dodecylbenzene sulfonate (SDBS) - water nanofluid with volumetric mass fractions of / equal to 0- 0.1%. The new microchannel is made of 2 layers and has sinusoidal cavities along with the heat sink. The study was conducted for Re = 50, 300, 700 and 1000 (laminar flow). Based on the results, higher Re leads to more convective heat transfer coefficient. Therefore, the value of temperature gradients decreases and on the other hand the effect of cooling fluid temperature in warm areas near solid wall becomes important. Using a higher value of Re results in the penetration of heat in the fluid layer decreases which in general will reduce the temperature of the outlet section in larger Re values. Also, larger Re value results in larger development length which is also a cause for lack of thermal development and dominance of the temperature of the coolant flow in the heat sink resulting in decreased outlet section temperature for higher Reynolds numbers. For Re = 50 and 300 because of lower fluid velocity, the effect of surface geometry factors such as sinusoidal paths or hollow parts (cavities) has a smaller influence on the pressure loss or friction factor of the flow.(c) 2022 THE AUTHORS. Published by Elsevier BV on behalf of Faculty of Engineering, Alexandria University This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/ 4.0/).

Automated summary

This paper presents a numerical simulation study of graphene nanoplatelet (GNP) - sodium dodecylbenzene sulfonate (SDBS) - water nanofluid. The study indicates that higher Reynolds numbers lead to increased convective heat transfer coefficients, decreased temperature gradients, and increased influence of cooling fluid temperature in the warm areas near the solid wall. Furthermore, higher Reynolds numbers also result in larger development lengths and decreased outlet section temperatures.