Correlation between plasma characteristics, morphology, and microstructure of sputtered CuAl alloy films with varied target geometry

The effect of target geometry on coating microstructure and morphology is correlated to changes in deposition conditions, plasma characteristics, and film growth during planar and hollow cathode sputtering. The sputtering plasma properties for the two target geometries were characterized via Langmuir probe analysis as a function of power density and Ar pressure to determine the evolution of ion density for each configuration. Films were then synthesized at the low (0.4 W cm(-2)) and high (1.2 W cm(-2)) power densities and characterized using x-ray diffraction, scanning electron microscopy, and electron backscatter diffraction to link changes in texturing, morphology, and microstructure with variations in ion density and sputtering deposition conditions caused by target geometry. It was observed that varying target geometry led to an over threefold increase in deposition rate, homologous temperature, and ion density, which altered the morphology and texture of the film without significant changes to the grain size.

Automated summary

The effect of target geometry on coating microstructure and morphology is investigated. Changes in deposition conditions, plasma characteristics, and film growth during planar and hollow cathode sputtering are correlated to target geometry. The study shows that varying target geometry significantly affects the deposition rate, temperature, and ion density, leading to changes in film morphology and texture without affecting grain size.