Experimental Study on Cooling Performance of a Hybrid Microchannel and Jet Impingement Heat Sink

Thermal management at a high heat flux is crucial for high-power electronic devices, and jet impingement cooling is a promising solution. In this paper, a hybrid heat sink combining a microchannel and jet impingement was designed, fabricated and tested in a closed-loop system with R134a as the working fluid. The thermal contact resistance was measured by using the steady-state method, and the thermal resistance of the heat sink was obtained at different heat fluxes and flow rates. The maximum heat dissipation of 400 W/cm(2) is achieved on a heater area of 210 mm(2), and the thermal resistance of the heat sink is 0.11 K/W with a pressure drop of 13.5 kPa under a flow rate of 1.90 L/min. Low thermal resistance can be achieved for the hybrid heat sink stemming from the highly-dense micro-jet array with separate inflow and outflow microchannels.

Automated summary

This paper presents the design and performance evaluation of a hybrid heat sink for high-power electronic devices. The results indicate that the hybrid heat sink achieves low thermal resistance under different heat fluxes and flow rates.