Effect of Polymer Substrate on Adhesion of Electroless Plating in Irradiation-Based Direct Immobilization of Pd Nanoparticles Catalyst

Pd nanoparticles were directly immobilized on acrylonitrile-butadiene-styrene copolymer (ABS), acrylonitrile-styrene copolymer (AS), polystyrene (PS), polyphenylene sulfide (PPS), poly(vinyl chloride) (PVC), polypropylene (PP), and polyethylene (PE) polymer substrates via chemical reactions induced by ionizing irradiation. X-ray photoelectron spectroscopy analysis revealed that the chemical state of the immobilized Pd nanoparticles depended on the polymer substrate type. Electroless plating was performed using the immobilized Pd nanoparticles as the catalyst, and Cu-plating films were deposited on all polymer substrates. The results of the tape-peeling test suggested that the chemical state of the immobilized Pd nanoparticles on the polymer substrates affected the plating adhesion strength. Notably, ABS with immobilized Pd particles exhibited a high adhesion strength beyond the practical level, even without prior chemical etching. It was presumed that the high adhesion strength was owing to the anchoring effect of the holes generated on the ABS surface by ionizing irradiation.

Automated summary

Pd nanoparticles were immobilized on different polymer substrates using ionizing irradiation-induced chemical reactions. The chemical state of the immobilized nanoparticles depended on the substrate type and affected the adhesion strength of copper plating.