A Numerical Investigation on Hydrothermal Performance of Micro Channel Heat Sink with Periodic Spatial Modification on Sidewalls

Electronic gadgets have been designed to incorporating very small components such as microcontrollers, electronic chips, transistors, microprocessors, etc. These components are exceptionally heat sensitive and can be wrecked if heat is not released. As a result, the thermal control of such components is critical to their optimum performance and extended life. The use of a microchannel heat sink (MCHS) has shown promising solutions to remove the excess heat. In this paper, we have proposed a novel design of MCHS and investigated it numerically. Four different surface modifications on the sidewall of the passage, namely, extended triangular surface (ETS), extended circular surface (ECS), triangular groove surface (TGS), and the circular groove surface (CGS) in the passage of the microchannel have been exploited in the Reynolds number of 100-900. In the presence of geometrical modification, the cooling capacities have been enhanced. The results show that the Nusselt numbers of ETS-MCHS, ECS-MCHS, TGS-MCHS, and CGS-MCHS are increased by 4.30, 3.61, 1.62, and 1.41 times in comparison to the Nusselt number of MCHS with smooth passage, while the friction factor values are increased by 7.33, 6.03, 2.74, and 1.68 times, respectively. In addition, the thermohydraulic performance parameter (THPP) has been evaluated and discussed. The fact that MCHS have THPP values greater than unity demonstrates that the passage's geometries are a practical means of achieving effective thermal management.

Automated summary

This study investigates a novel design of microchannel heat sink (MCHS) and explores the impact of different surface modifications on heat transfer performance. The results demonstrate that geometric modifications significantly enhance the cooling capacity, highlighting the importance of effective thermal management for electronic devices.