Interfacial Engineering Methods in Thermoplastic Composites: An Overview

The paper critically analyzed different interfacial enhancing methods used in thermoplastic composites. Although the absence of cross-linked polymer chains and chemical bonds on solidification enables the thermoplastics to be remelted, it creates weak interfacial adhesion between fibre reinforcements and the thermoplastic matrix. The weak fibre-matrix interface bonding reduces the efficiency with which the applied load can be transferred between these composite constituents, causing the composite to fail prematurely. Their need for high-temperature processing, poor compatibility with other polymer matrices, and relatively high viscosity render thermoplastics challenging when used to manufacture composite laminates. Therefore, various methods, including nanoparticles, changing the polarity of the fibre surface by plasma etching, chemical treatment with ozone, or an oxidative attack at the fibre surface, have been applied to improve the fibre/matrix bonding in thermoplastic composites. The fabrication steps followed in these techniques, their progress in research, and the associated toughening mechanisms are comprehensively discussed in this paper. The effect of different fibre-matrix interfacial enhancement methods on the mechanical properties of thermoplastic composites is also deliberated.

Automated summary

This paper critically analyzes different methods used for enhancing the interface in thermoplastic composites. Due to the absence of cross-linked polymer chains and chemical bonds, the interfacial adhesion between fiber reinforcements and the thermoplastic matrix is weak. Various methods, including nanoparticles, plasma etching, chemical treatment, and oxidative attack have been explored to improve the fiber/matrix bonding. The paper comprehensively discusses the fabrication steps, research progress, toughening mechanisms, and the effect of different interfacial enhancement methods on the mechanical properties of thermoplastic composites.