☆
4.4
Article
Numerical Analysis of 3D CSP MEMS Under Thermal Cycle-Impact Coupled Multiphysics Loads
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2023)
评价这篇论文
主要评分表示论文的整体质量水平。次要评分独立反映论文的优点或缺点。
Find the ideal target journal for your manuscript
Explore over 38,000 international journals covering a vast array of academic fields.
SearchAdd your recorded webinar
Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.
Upload Now