期刊
WELDING IN THE WORLD
卷 67, 期 5, 页码 1337-1345出版社
SPRINGER HEIDELBERG
DOI: 10.1007/s40194-023-01492-9
关键词
Pulsed pressure diffusion bonding; Nano-multilayer film; Heating rate; Tensile strength
This article proposes a novel Cu/W nano-multilayer film as filler material for pulsed pressure diffusion bonding of Ti-6Al-4 V alloy. By increasing the rate of heating, Cu diffused into the Ti-6Al-4 V base metal, reducing the formation of brittle compounds in the bonding and enhancing the tensile strength of the joint.
Nano-multilayer films have demonstrated high viability as filler metals for low-temperature bonding applications. This article proposes a novel Cu/W nano-multilayer film as filler material for pulsed pressure diffusion bonding of Ti-6Al-4 V alloy. Cu/W nano-multilayer filler metal with a single layer thickness of 4 mu m had a modulation ratio of 1:1. The effect of heating rate on the properties of joints was investigated. The typical joint structure was mainly composed of Ti-6Al-4 V base metal region, CuxTiy intermetallic compound mixed region, and Cu/W elemental region. By increasing the rate of heating, Cu diffused into the Ti-6Al-4 V base metal, reducing the formation of brittle compounds in the bonding and enhancing the tensile strength of the joint. At the heating rate of 30 degrees C/s, the tensile strength of joint reached a maximum of 76.7 MPa. Cu/W nano-multilayer film has excellent potential for rapid diffusion bonding application.
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