Rapid in situ wetting measurement for nanosolder by electron beam irradiation

In nanosoldering, the wettability of nanosolder is a key factor to gauge the contacts' firmness. Here, a novel in situ wetting measurement method by using electron beam irradiation in transmission electron microscopy has been proposed, which has the crucial advantages of dynamically observing the wetting process between nanosolder and nanomaterial to be soldered, rapidly measuring the contact angle, and greatly avoiding the complex procedures in traditional method. The experimental tests show that the contact angle of a reflowed 97Sn3Cu nanosolder drop on a WO3 nanowire obtained by the new method is consistent with that obtained by the traditional method. This novel wetting measurement method is aimed at promoting the application of nanosolders in nanosoldering.

Automated summary

In this study, a novel in situ wetting measurement method using electron beam irradiation in transmission electron microscopy is proposed, which enables dynamic observation of the wetting process between nanosolder and nanomaterial, rapid measurement of the contact angle, and avoids complex procedures in traditional methods. Experimental tests show that the obtained contact angle using the new method is consistent with the traditional method, indicating its potential in promoting the application of nanosolders in nanosoldering.