Liquid crystal epoxy composites based on functionalized boron nitride: Synthesis and thermal properties

A composite was prepared by in-situ polymerization of liquid crystal epoxy (LCE4) with a low dielectric and high thermal conductivity boron nitride (BN) filler, which the filler (f-BN) was surface-functionalized by gamma-glycidoxypropyltrimethoxysilane (KH560) and aminopropylisobutyl polyhedral oligomeric silsesquioxane (NH2-POSS). The surface-functionalized BN was more uniformly dispersed in LCE4, which improved the interfacial compatibility between inorganic and organic phases. Compared with pure LCE4, KH560, and NH2-POSS modified f-BN/LCE4 composites exhibited a higher glass transition temperature, better thermal stability, and higher thermal conductivity. For example, when the f-BN content reached 30 wt%, the energy storage modulus of the composite increased to 2580 MPa, and the glass transition temperature was 103?. The thermal conductivity of this 30 wt% f-BN composite was 0.48 W m(-1) K-1, 128.6% higher than that of pure LCE4. In addition, thermal stability, low hygroscopicity, and dielectric properties of the composites were characterized and analyzed to explore the application prospects of f-BN/LCE4 composites in electronic packaging and in high-performance microelectronic devices.

Automated summary

A composite material was prepared by in-situ polymerization of liquid crystal epoxy (LCE4) and a surface-functionalized boron nitride filler (f-BN). The surface-functionalization improved the dispersion of f-BN in LCE4, leading to improved interfacial compatibility. The modified f-BN/LCE4 composites exhibited higher glass transition temperature, better thermal stability, and higher thermal conductivity compared to pure LCE4.