4.7 Article

Ultra-low loss polyphenylene oxide-based composites with negative thermal expansion fillers

期刊

POLYMER COMPOSITES
卷 44, 期 3, 页码 1849-1858

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WILEY
DOI: 10.1002/pc.27209

关键词

composites; dielectric properties; polyphenylene oxide; thermal expansion

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This study successfully reduced the coefficient of thermal expansion (CTE) and improved the dielectric properties of polymer composites by incorporating Zr2WP2O12 (ZWP) particles. The performance of the PPO/ZWP composites was superior to that of traditional PPO/silica composites. Therefore, PPO/ZWP composites may be promising materials for high-frequency applications in electronic packaging fields.
The mismatch of coefficient of thermal expansion (CTE) of components has created numerous reliability issues in electronic packages. Incorporating inor-ganic fillers into polymer matrices has been proven to be an effective way to reduce the CTE, but properly balancing CTE with other key properties of the composites is still a challenge. In the current work, negative thermal expan-sion Zr2WP2O12 (ZWP) particles were prepared by a high-temperature solid-phase synthesis method. Polyphenylene oxide (PPO)-based composites with different volume fractions (0, 10, 20, 30 vol%) of ZWP particles were prepared and their thermal expansion and dielectric properties were characterized. PPO/silica composites with the same volume fractions of silica were also pre-pared and characterized for comparison. With the content of filler increased from 0 to 30 vol%, the CTE of the PPO/ZWP composites reduced from 74.2 to 45.4 ppm/degrees C, which is more significant than that of the PPO/silica composites (48.0 ppm/degrees C with 30 vol% silica). Meanwhile, the dielectric loss of PPO/ZWP composites decreased significantly from 0.0024 (0 vol% ZWP) to 0.0018 (30 vol % ZWP) at 10 GHz, which is better than PPO/silica composites (0.0019 with 30 vol% Silica). The PPO/ZWP composites exhibit excellent comprehensive properties, which may be promising materials for high-frequency applications in electronic packaging fields.

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