4.7 Article

Double-sided femtosecond 3D printing technology based on a specific mask

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OPTICS AND LASERS IN ENGINEERING
卷 161, 期 -, 页码 -

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ELSEVIER SCI LTD
DOI: 10.1016/j.optlaseng.2022.107328

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3D printing; Femtosecond laser direct writing; Double-sided femtosecond 3D printing; Mask; Micro-optics system

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This paper proposes a double-sided femtosecond three-dimensional printing technology that can manufacture micro/nanostructures on both sides of the substrate. The technology achieves accurate double-sided manufacturing with minimal height and alignment errors, and has been successfully applied to fabricate a double-sided micro-optics system. The imaging quality of the system is maintained, indicating the reliability and effectiveness of the proposed technique.
In this paper, we propose a double-sided femtosecond three-dimensional (3D) printing (DSF-3DP) technology to manufacture micro/nanostructures on both sides of the substrate. DSF-3DP is based on femtosecond laser direct writing (FsLDW), with the help of the operating program to recognize graphics and real-time change and processing of data to achieve accurate double-sided manufacturing. This method uses SU-8 photoresist as processing material and achieves double-sided height error within 5 mu m and horizontal alignment error within 2.6 mu m. Further application on fabricating a double-sided micro-optics system (DSMOS) has been implemented. The influence of height and horizontal alignment error on the imaging quality of DSMOS can be ignored. The modulation transfer function (MTF) of DSMOS manufactured by DSF-3DP is only 0.06 lower than the ideal value at 80 lp/mm, which almost maintains the image quality of the designed optical system. These results indicate that DSF-3DP provides a simple, reliable, and economical double-sided manufacturing technique in the lab.

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