4.6 Article

Approximate residual stress and plastic strain profiles for laser-peened alloy 600 surfaces

期刊

NUCLEAR ENGINEERING AND TECHNOLOGY
卷 55, 期 4, 页码 1250-1264

出版社

KOREAN NUCLEAR SOC
DOI: 10.1016/j.net.2022.12.010

关键词

Alloy 600; Approximate solutions; FE laser shock peening simulation; Residual stress and plastic strain

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This paper presents approximate in-depth residual stress and plastic strain profiles for laser-peened alloy 600 surface via FE analysis. The effects of the initial welding residual stress and the number of shots are quantified in the approximations. The proposed profiles are validated by comparing with published LSP experimental results for welded plates, and the effects of the initial welding residual stress and the number of shots on these profiles are discussed. The proposed profile can be directly applied to predict the mitigation effect of LSP on PWSCC and to efficiently perform structural integrity assessment of laser peened nuclear components.
This paper presents approximate in-depth residual stress and plastic strain profiles for laser-peened alloy 600 surface via FE analysis. In approximations, effects of the initial welding residual stress and the number of shots are quantified. Based on FE analysis results, residual stress profiles are quantified by two variables; the maximum difference in stress before and after LSP, and the depth up to which the compressive residual stress exists. Plastic strain profiles are quantified by one variable, the maximum equivalent plastic strain at the surface. The proposed profiles are validated by comparing with published LSP experimental results for welded plates. Effects of the initial welding residual stress and the number of shots on these variables are discussed. The proposed profile can be directly applied to predict the mitigation effect of LSP on PWSCC and to efficiently perform structural integrity assessment of laser peened nuclear components.(c) 2022 Korean Nuclear Society, Published by Elsevier Korea LLC. This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/).

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