相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。Electrodeposition and Growth Mechanism of Nanotwinned Copper in High Aspect-Ratio via Structures
Hsin-Yu Chen et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2021)
Atomic-scale diffusion rates during growth of thin metal films on weakly-interacting substrates
A. Jamnig et al.
SCIENTIFIC REPORTS (2019)
A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production
K. N. Tu et al.
JOURNAL OF APPLIED PHYSICS (2019)
Twin-mediated epitaxial growth of highly latticemis-matched Cu/Ag core-shell nanowires
Wei-Lun Weng et al.
NANOSCALE (2018)
Slip-activated surface creep with room-temperature super-elongation in metallic nanocrystals
Li Zhong et al.
NATURE MATERIALS (2017)
Mass transport phenomena in copper nanowires at high current density
Yu-Ting Huang et al.
NANO RESEARCH (2016)
Optimization of the nanotwin-induced zigzag surface of copper by electromigration
Hsin-Ping Chen et al.
NANOSCALE (2016)
Chemical reactivity of twin-modified copper nanowire surfaces
Chun-Lung Huang et al.
APPLIED PHYSICS LETTERS (2015)
Atomic Observation of Catalysis-Induced Nanopore Coarsening of Nanoporous Gold
Takeshi Fujita et al.
NANO LETTERS (2014)
The Role of Surface Oxygen in the Growth of Large Single-Crystal Graphene on Copper
Yufeng Hao et al.
SCIENCE (2013)
Formation and Analysis of Core-Shell Fine Structures in Pt Bimetallic Nanoparticle Fuel Cell Electrocatalysts
Marc Heggen et al.
JOURNAL OF PHYSICAL CHEMISTRY C (2012)
Epitaxial Graphene on Cu(111)
Li Gao et al.
NANO LETTERS (2010)
Observation of atomic diffusion at twin-modified grain boundaries in copper
Kuan-Chia Chen et al.
SCIENCE (2008)
Atom diffusion of small Cu clusters across facet-facet barriers over Cu{111} surfaces
Boris H. Aguilar et al.
MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING (2007)
Controlling the charge state of individual gold adatoms
J Repp et al.
SCIENCE (2004)
Recent advances on electromigration in very-large-scale-integration of interconnects
KN Tu
JOURNAL OF APPLIED PHYSICS (2003)
Electromigration reliability issues in dual-damascene Cu interconnections
ET Ogawa et al.
IEEE TRANSACTIONS ON RELIABILITY (2002)