Modification of the Hall-Petch relationship for submicron-grained fcc metals

Experimental data show that the conventional Hall-Petch relationship cannot be maintained in its original form for metals having submicrometer structures. We now propose a dislocation model which modifies the Hall-Patch relationship to provide a uniform description of the grain size strengthening of submicron-structured face -centered cubic (f.c.c.) metals and solid solution alloys.

Automated summary

Experimental data show that the conventional Hall-Petch relationship is not applicable to metals with submicrometer structures. A new dislocation model is proposed to modify the Hall-Petch relationship and provide a uniform description of grain size strengthening in submicron-structured f.c.c. metals and solid solution alloys.