4.5 Article

Enhanced mechanical and electrical properties of ECR-glass reinforced polyimide composites with incorporation of TiO2 for insulation applications

期刊

JOURNAL OF THERMOPLASTIC COMPOSITE MATERIALS
卷 36, 期 10, 页码 3837-3851

出版社

SAGE PUBLICATIONS LTD
DOI: 10.1177/08927057221142233

关键词

Polyimide; ECR-glass; TiO2; mechanical; dielectric; electrical

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This paper presents the mechanical behavior and electrical properties of novel composites consisting of ECR-glass reinforced polyimide loaded with TiO2 nanoparticles. The results show that the incorporation of TiO2 nanoparticles improves the hardness, stiffness, and elastic modulus of the composites, while reducing the dielectric constant, dielectric loss, and electrical conductivity.
This paper presents the mechanical behaviour of novel class composites consisting of ECR-glass type reinforced polyimide (PI) composite loaded with TiO2 nanoparticles. ECR glass reinforced PI composites were fabricated by adding TiO2 particles at three different concentrations namely; 2, 4, and 6 wt% using 3D-Turbula dispersion and Spark Plasma Sintering (SPS) method. The morphologies, crystallinity, mechanical, and electrical properties of the produced composites were evaluated using scanning electron microscope (SEM), X-ray diffractometer, nanoindentation test, and LCR meter device. The SEM results revealed that the TiO2 nanoparticles were homogenously dispersed into the PI composites. The mechanical properties, such as hardness, stiffness, and elastic modulus of the pure PI and ECR glass reinforced PI composite was improved by the incorporation of TiO2 nanoparticles. Maximum hardness and elastic modulus values of 2.19 GPa and 13.99 GP, respectively, was observed in ECR reinforced PI composited loaded with 6 wt% TiO2 nanoparticles. In addition, ECR glass reinforced PI composites with 6 wt% TiO2 nanoparticles depicted the lowest dielectric constant (1.18), dielectric loss (1.14) and electrical conductivity (3.16 x 10(-6) S/cm). Finally, the findings suggest the easy processability of PI nanocomposites and their potential for mechanical and electrical insulation applications.

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