Chemical Preparation of Metallic Cu Layer on Glass Substrate Using Intermediate Cu(OH)2/Cu(O, S) Bilayer

A metallic Cu layer with a sheet resistance of 0.19 omega was chemically prepared on a glass substrate by chemical reduction of the intermediate Cu(OH)(2)/Cu(O,S) bilayers using dimethylamine-borane (DMAB), while Cu(OH)(2), and Cu(O,S) layers were fabricated by a sequential chemical bath deposition (CBD) in aqueous solutions containing copper (II) nitrate hydrate and ammonium nitrate with urea and thiourea. The thickness of the Cu(OH)(2) and resultant Cu layers were strongly affected by the structure under the Cu(O, S) layer, and a metallic Cu layer was formed mainly from the Cu(OH)(2) layer. The reduction reactions of Cu(OH)(2) and Cu(O, S) were discussed based on thermodynamics.

Automated summary

A metallic Cu layer with a sheet resistance of 0.19 omega was chemically prepared on a glass substrate, and the reduction reactions of Cu(OH)(2) and Cu(O, S) were discussed based on thermodynamics.