相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。Transition from necking to cavitation driven tertiary creep with length scale in constrained ductile metal joints
Anwesha Kanjilal et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2022)
Size dependent creep deformation of elastically constrained compliant metallic
Anwesha Kanjilal et al.
MATERIALIA (2022)
Anisotropic steady-state creep behavior of Single-crystal fl-Sn: A continuum constitutive model based on crystal viscoplasticity
Q. Jiang et al.
INTERNATIONAL JOURNAL OF PLASTICITY (2021)
Recent advances in nano-materials for packaging of electronic devices
Shuye Zhang et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2019)
Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging
Shaobin Wang et al.
APPLIED SCIENCES-BASEL (2019)
Growth of Interfacial Intermetallic Compound Layer in Diffusion-Bonded SAC-Cu Solder Joints During Different Types of Thermomechanical Excursion
Anwesha Kanjilal et al.
JOURNAL OF ELECTRONIC MATERIALS (2018)
Solid-state diffusion-controlled growth of the intermediate phases from room temperature to an elevated temperature in the Cu-Sn and the Ni-Sn systems
Varun A. Baheti et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2017)
Growth of phases in the solid-state from room temperature to an elevated temperature in the Pd-Sn and the Pt-Sn systems
Varun A. Baheti et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2017)
Critical evaluation of creep behavior of Sn-Ag-Cu solder alloys over wide range of temperatures
Anwesha Kanjilal et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2017)
Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration
Yu-An Shen et al.
SCRIPTA MATERIALIA (2017)
Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling
Linmei Yang et al.
JOURNAL OF ELECTRONIC MATERIALS (2015)
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
K. N. Tu et al.
MICROELECTRONICS RELIABILITY (2013)
Microstructurally Adaptive Model for Primary and Secondary Creep of Sn-Ag-Based Solders
Praveen Kumar et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2012)
Effect of rapid solidification on mechanical properties of a lead free Sn-3.5Ag solder
R. M. Shalaby
JOURNAL OF ALLOYS AND COMPOUNDS (2010)
Viscoplastic Creep Response and Microstructure of As-Fabricated Microscale Sn-3.0Ag-0.5Cu Solder Interconnects
Gayatri Cuddalorepatta et al.
JOURNAL OF ELECTRONIC MATERIALS (2010)
Electromigration in Sn-Cu intermetallic compounds
C. C. Wei et al.
JOURNAL OF APPLIED PHYSICS (2009)
The effect of pre-aging on the electromigration of flip-chip SnAg solder joints
Po-Chun Yang et al.
JOM (2008)
Microstructure characterization and creep behavior of Pb-free Sn-rich solder alloys: Part I. Microstructure characterization of bulk solder and solder/copper joints
R. S. Sidhu et al.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2008)
Effect of Ag and Cu concentrations on the creep behavior of Sn-based solders
T. Chen et al.
JOURNAL OF ELECTRONIC MATERIALS (2008)
Microstructure characterization and creep behavior of Pb-free Sn-rich solder alloys: Part II. Creep behavior of bulk solder and solder/copper joints
R. S. Sidhu et al.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2008)
Anomalous creep in Sn-rich solder joints
HG Song et al.
MATERIALS TRANSACTIONS (2002)
The creep properties of lead-free solder joints
HG Song et al.
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY (2002)
Creep properties of Sn-Ag solder joints containing intermetallic particles
S Choi et al.
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY (2001)
分享论文
