Proton radiation effects on electronic defect states in MOCVD-grown (010) β-Ga2O3

The impact of 1.8 MeV proton irradiation on metalorganic chemical vapor deposition grown (010) beta-Ga2O3 Schottky diodes is presented. It is found that after a 10.8 x 10(13) cm (- 2) proton fluence the Schottky barrier height of ( 1.40 +/- 0.05 eV) and the ideality factor of ( 1.05 +/- 0.05) are unaffected. Capacitance-voltage extracted net ionized doping curves indicate a carrier removal rate of 268 +/- 10 cm (- 1). The defect states responsible for the observed carrier removal are studied through a combination of deep level transient and optical spectroscopies (DLTS/DLOS) as well as lighted capacitance-voltage (LCV) measurements. The dominating effect on the defect spectrum is due to the E-C-2.0 eV defect state observed in DLOS and LCV. This state accounts for similar to 75% of the total trap introduction rate and is the primary source of carrier removal from proton irradiation. Of the DLTS detected states, the E-C-0.72 eV state dominated but had a comparably smaller contribution to the trap introduction. These two traps have previously been correlated with acceptor-like gallium vacancy-related defects. Several other trap states at E-C-0.36, E-C-0.63, and E C-1.09 eV were newly detected after proton irradiation, and two pre-existing states at E-C-1.2 and E-C-4.4 eV showed a slight increase in concentration after irradiation, together accounting for the remainder of trap introduction. However, a pre-existing trap at E-C-0.40 eV was found to be insensitive to proton irradiation and, therefore, is likely of extrinsic origin. The comprehensive defect characterization of 1.8 MeV proton irradiation damage can aid the modeling and design for a range of radiation tolerant devices.

Automated summary

The impact of 1.8 MeV proton irradiation on metalorganic chemical vapor deposition grown (010) beta-Ga2O3 Schottky diodes was studied. It was found that the Schottky barrier height and ideality factor were unaffected after a certain proton fluence. Carrier removal rate and defect states responsible for the observed carrier removal were analyzed. The comprehensive defect characterization can aid the modeling and design for radiation tolerant devices.