Achieving highly anisotropic thermal and electrical conductivities via synergistic distribution of boron nitride and graphene nanosheets in multilayered composites

It has long been a challenging problem to fabricate polymeric composites that could combine high thermal conductivity, electrical insulating and anti-static capacity. Dirven by the fascinating features of multilayer structure in nature, here we report a series of multilayered boron nitride/graphene nanoplate (BN/GNP) composites by virtue of a sequentially layered assembly strategy, which is realized through unidirectional freezing drying followed by alternative compression molding. Due to the high orientation state, as well as the synergistic distribution of BN and GNP in multilayered pattern, the compositing BN/GNP film with optimized filler content displays a satisfying in-plane thermal conductivity of 21.9 W m-1 K-1, which is 6161 % and 669 % higher than that of pure CS and isotropic composite, respectively. Meanwhile, the qualification of such compositing film in factual dissipation of exhaust heat generated by complex electronic devices is further explored and demonstrated. Moreover, such compositing film possesses distinct anisotropic elec-trical performance, which could simultaneously satisfy the requirement of through-plane insulating and in -plane antistatic property. Given such superior performance, as well as the green and facile process, such work is believed to further inspire the design and fabrication of intelligent electronic device with excellent heat dissipation capacity. (c) 2022 Elsevier B.V. All rights reserved.

Automated summary

In this study, multilayer boron nitride/graphene composites were successfully fabricated using a sequentially layered assembly strategy. These composites exhibited excellent properties in terms of thermal conductivity, electrical insulation, and anti-static capacity. Furthermore, their practical application in dissipating heat generated by electronic devices was demonstrated. The findings of this study have the potential to inspire the design and fabrication of intelligent electronic devices with superior heat dissipation capacity.