Convective flow over heat dissipating fins for application of electronic package cooling using curved boundary scheme lattice Boltzmann method

Purpose The purpose of this study is to address a problem in cooling of an electronic package where the dissipating fins transfer the extra heat energy from the heat source (i.e. electronic devices) to the heat sink (i.e. environment). To this end, the convective heat transfer of nanofluid flow over dissipating fins is simulated using a numerical approach, whereas the properties of nanofluid are evaluated based on the experimental measurements and used in the numerical process. Design/methodology/approach To simulate the convective flow, the lattice Boltzmann method is used. Also, the curved boundary scheme is used to enhance the capability of lattice Boltzmann method (LBM) in the simulation of natural convection in curved boundaries. In addition, the second law analysis is used based on total and local approaches. Findings To improve the cooling performance of fins, a modern technique is used, which is using of nanofluid. For this purpose, samples of SiO2-liquid paraffin with mass fractions of 0.01, 0.05, 0.1, 0.5 and 1 (Wt.%) in a temperature range of 25-60 degrees C are provided, and the required thermal and physical properties of samples including thermal conductivity and dynamic viscosity are measured during experimental work. The extracted results are used in the numerical simulations using derived correlations. Originality/value The originality of the present work is using a modern numerical method in the investigation of an engineering application and combining it with experimental data.

Automated summary

The purpose of this study is to address the cooling issue of electronic packages by simulating the convective heat transfer of nanofluid flow over dissipating fins using a numerical approach and evaluating the properties of nanofluid based on experimental measurements.