4.7 Article

Thermal resistance mapping along a single cup-stacked carbon nanotube with focused electron beam heating

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijheatmasstransfer.2022.123418

关键词

Thermal conductivity; Electron beam heating; Line -shaped heat flux sensor; Cup -stacked carbon nanotube; Thermal contact resistance

资金

  1. JST FOREST Program [JPMJFR212M]
  2. JST CREST [JP- MJCR18I1]
  3. JSPS KAKENHI [JP20H02090, JP21K18693]
  4. China Scholarship Council

向作者/读者索取更多资源

This new thermal measurement method combines electron beam heating with suspended line-shaped heat flux sensors, allowing for high-resolution mapping of thermal property distribution in SEM. By eliminating thermal contact resistance error, the true thermal conductivity of the material can be accurately extracted.
The structural non-uniformity in low-dimensional materials, including interfaces and defects, makes it highly desirable to map the thermal property distribution with a high spatial resolution. Meanwhile, eliminating the error of thermal contact resistance at the sample-sensor junction has remained a crit-ical challenge in nanoscale thermal conductivity measurement. Here, we combine the electron beam (EB) heating with two suspended line-shaped heat flux sensors and have achieved the in-situ thermal re-sistance mapping along a single cup-stacked carbon nanotube (CNT) in a scanning electron microscope (SEM). The CNT is anchored between the two suspended metal lines, and the focused electron beam heats the CNT locally with a nanometer-range spatial resolution, while the two metal lines simultane-ously measure the heat fluxes induced by the EB heating. By sweeping the focused EB along the CNT, we can obtain the spatially resolved thermal resistance, from which the true thermal conductivity of the CNT was extracted to be around 40 W/m middotK without the thermal contact resistance error. This SEM-based in-situ thermal measurement method can accelerate high-resolution nanomaterials characterization and the elucidation of nanoscale heat transfer.(c) 2022 Elsevier Ltd. All rights reserved.

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