期刊
IEEE TRANSACTIONS ON POWER ELECTRONICS
卷 38, 期 1, 页码 472-490出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TPEL.2022.3200469
关键词
Integrated circuit interconnections; Silicon; Silicon carbide; Wires; Bonding; Reliability; Packaging; Challenges; gallium nitride (GaN); interconnection materials; packaging; power semiconductor devices; semiconductor device reliability; silicon carbide (SiC); topside interconnections; wide bandgap (WBG) semiconductors
This article provides a comprehensive review of topside interconnection technologies for wide bandgap (WBG) semiconductor power devices and modules. It discusses the challenges, driving factors, and various interconnection materials, and presents potential future directions for development.
Due to their superior material properties, wide bandgap (WBG) semiconductors enable the application of power electronics at higher temperature operation, higher frequencies, and higher efficiencies compared to silicon (Si). However, the commonly-used aluminum wire bonding as topside interconnection technology prevents WBG semiconductors from reaching their full potential, due to inherent parasitic inductances, large size, heat dissipation, and reliability issues of wire bonding technology. Therefore, this article presents a comprehensive review of topside interconnection technologies of WBG semiconductor power devices and modules. First, the challenges and driving factors for the interconnection of WBG semiconductor dies are discussed. Second, for each widely commercially used WBG semiconductor, i.e., silicon carbide and gallium nitride, technical details and innovative features of state-of-the-art interconnection techniques in packages are reviewed. Then, the majority of existing topside interconnection materials for WBG semiconductors are categorized and compared, followed by a discussion of their advantages, challenges, and failure modes. Based on this elaborate discussion, potential future directions of the interconnection technology development are given. It is concluded that the superior performance of WBG semiconductors can be obtained by combining novel materials with innovative designs for the topside interconnections.
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