4.5 Article

Interfirm Transformative Capacity Within Global Value Chains

期刊

IEEE TRANSACTIONS ON ENGINEERING MANAGEMENT
卷 69, 期 6, 页码 3253-3264

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TEM.2020.3037870

关键词

Technological innovation; Knowledge engineering; Lead; Production; Sun; Collaboration; Business; Global value chains (GVCs); innovation impact; interfirm innovation; interfirm transformative capacity; network centrality; structural holes

资金

  1. China Scholarship Council [201806340132]

向作者/读者索取更多资源

This study investigates the impact of global value chains (GVCs) on a firm's innovation impact. It introduces the concept of interfirm transformative capacity and explores three mechanisms through which this capacity affects innovation in GVCs. The study finds that engagement in a lead firm's GVC, structural holes, and network centrality have an impact on a focal firm's innovation impact. The hypotheses are tested using a dataset of Apple suppliers and their patent impacts, and the results support the proposed mechanisms.
How do global value chains (GVCs) affect a firm's innovation impact? Working as international communities, GVCs are rich in knowledge and resource interchange. The prior literature has focused on knowledge absorbing or internal knowledge transfer within firms for in-house innovation. However, scant research has focused on promoting innovation across interfirm networks in a GVC context. This article develops a new concept of interfirm transformative capacity as a firm's ability to transfer developed technology knowledge across time, space, and firm networks. In this article, we explore three mechanisms of interfirm transformative capacity in GVCs: 1) choosing knowledge intermediaries, 2) transmitting and maintaining knowledge over time and space, and 3) reactivating and synthesizing knowledge. We predict that engagement in a lead firm's GVC, structural holes, and network centrality will affect a focal firm's innovation impact as a result of interfirm transformative capacity. Integrator suppliers have higher innovation impacts than modular suppliers. To test these three mechanisms, we build a novel dataset from a five-year panel of Apple suppliers and their patent impacts. The results support our hypotheses related to the mechanisms of interfirm transformative capacity. Our theoretical elaboration and empirical findings have significant implications for innovation policy within, and governance of, GVCs.

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