期刊
CHEMICAL ENGINEERING JOURNAL
卷 451, 期 -, 页码 -出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.cej.2022.138674
关键词
Supramolecular polymers; Supramolecular adhesives; High/low temperature resistances; Real-time monitoring; Hydrogen bonding formation
A supramolecular approach was used to create adhesive materials with excellent temperature resistance and strong adhesion capacity by combining molecular recognition and supramolecular polymerization. The resulting poly(A-C) showed tough adhesion effects at high and low temperatures without any additives. A customized device allowed for real-time monitoring of the adhesion behavior, as well as visualizing and wirelessly alarming adhesion failure.
A supramolecular approach was applied to the construction of adhesive materials with excellent temperature resistance and strong adhesion capacity. Supramolecular hot-molten glues were prepared from two small compounds, acrylic acid (A) and choline chloride (C), using a combination of molecular recognition (formation of supramonomers) and supramolecular polymerization (formation of cross-linked polymers). The coexistence of covalent poly(A) backbones and non-covalent crosslinker C units enabled the poly(A-C)s to display tough adhesion effects with long-term stability at high (150 degrees C, 5.18 MPa) and low temperatures (-196 degrees C, 9.52 MPa) without any additives. Real-time and quantitative monitoring of the adhesion behavior of poly(A-C)s was successfully realized over a wide temperature range of -80 to 150 degrees C, using a customized device that allowed for easy monitoring of the adhesion duration, attenuation, and failure. Importantly, adhesion failure was visualized and wirelessly alarmed.
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