3D Printing of Liquid Metal Embedded Elastomers for Soft Thermal and Electrical Materials

Liquid metal embedded elastomers (LMEEs) are composed of a soft polymer matrix embedded with droplets of metal alloys that are liquid at room temperature. These soft matter composites exhibit exceptional combinations of elastic, electrical, and thermal properties that make them uniquely suited for applications in flexible electronics, soft robotics, and thermal management. However, the fabrication of LMEE structures has primarily relied on rudimentary techniques that limit patterning to simple planar geometries. Here, we introduce an approach for direct ink write (DIW) printing of a printable LMEE ink to create three-dimensional shapes with various designs. We use eutectic gallium-indium (EGaIn) as the liquid metal, which reacts with oxygen to form an electrically insulating oxide skin that acts as a surfactant and stabilizes the droplets for 3D printing. To rupture the oxide skin and achieve electrical conductivity, we encase the LMEE in a viscoelastic polymer and apply acoustic shock. For printed composites with a 80% LM volume fraction, this activation method allows for a volumetric electrical conductivity of 5 x 104 S cm-1 (80% LM volume) -significantly higher than what had been previously reported with mechanically sintered EGaIn-silicone composites. Moreover, we demonstrate the ability to print 3D LMEE interfaces that provide enhanced charge transfer for a triboelectric nanogenerator (TENG) and improved thermal conductivity within a thermoelectric device (TED). The 3D printed LMEE can be integrated with a highly soft TED that is wearable and capable of providing cooling/heating to the skin through electrical stimulation.

Automated summary

LMEEs are composed of soft polymer matrix embedded with liquid metal alloys. A new approach for direct ink write printing of printable LMEE ink is introduced, enabling creation of three-dimensional shapes with various designs. LMEE exhibits exceptional electrical, elastic, and thermal properties suitable for flexible electronics, soft robotics, and thermal management applications.