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High entropy alloys (HEAs) as a binder material for heavy tungsten alloys, tungsten carbide hardmetals, and titanium carbo-nitride based cermet composites-a comprehensive review

出版社

TAYLOR & FRANCIS LTD
DOI: 10.1080/2374068X.2022.2142397

关键词

Tungsten carbide hard metals; tungsten heavy alloys; cermet composites; binder; cobalt; high entropy alloys; microstructure; grain size; tribo-corrosion

资金

  1. NIT-Srinagar, MME Department

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This article offers insights into high-entropy alloys (HEAs) as potential binder materials for tungsten carbides, heavy tungsten alloys, and titanium carbo-nitride based cermet composites. By enhancing mechanical properties and tribo-corrosion performance, HEAs-based binder materials can improve the performance and service life of drill bits in mining and cutting operations.
The current review gives an insight into high-entropy alloys (HEAs) as a new possible binder material for the tungsten carbides, heavy tungsten alloys, and titanium carbo-nitride (Ti(C,N)) based cermet composites. The existing binder materials (for instance, Co, Ni, etc.), produced by powder metallurgy methods, have limited tool bits performance and short service life while mining applications; however, replacing existing binders with more accurate binder material is still a great challenge for researchers. Therefore, the present review is explicitly and precisely dedicated to the finding of the HEAs-based binder materials for the WC hard metals, heavy tungsten alloys, and Ti(C,N) cermet composites to produce high-performance drill bits associated with higher service life in the mining and cutting operations by improving the mechanical properties and tribo-corrosion performance. In this review, the performance of the HEAs over conventional binder materials has been compared and discussed concerning hardness, fracture toughness, oxidation, and tribo-corrosion resistance. The HEA-based binders showed low transformation kinetics and a lack of solubility as compared to the conventional binder. Hence, after optimising the composition, microstructures, properties, and costs of the HEAs-based binder materials, it can be estimated that in the upcoming year, the HEAs-based binder may replace the conventional binder.

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