期刊
PHOTONICS
卷 9, 期 11, 页码 -出版社
MDPI
DOI: 10.3390/photonics9110799
关键词
silicon photonics; integrated photonics; fiber-to-chip coupler
类别
资金
- Affiliated Institute of Electronics and Telecommunications Research Institute (ETRI) [2021-004]
In this study, a new approach to fiber-array fiber-to-chip couplers is proposed, utilizing a high numerical aperture fiber positioned on a silicon waveguide to achieve high coupling efficiency and broad alignment tolerance ranges.
The silicon photonics market has grown rapidly over recent decades due to the demand for high bandwidth and high data-transfer capabilities. Silicon photonics leverage well-developed semiconductor fabrication technologies to combine various photonic functionalities on the same chip. Complicated silicon photonic integrated circuits require a mass-producible packaging strategy with broadband, high coupling efficiency, and fiber-array fiber-to-chip couplers, which is a big challenge. In this paper, we propose a new approach to fiber-array fiber-to-chip couplers which have a complementary metal-oxide semiconductor-compatible silicon structure. An ultra-high numerical aperture fiber is polished at a grazing angle and positioned on a taper-in silicon waveguide. Our simulation results demonstrate a coupling efficiency of more than 90% over hundreds of nanometers and broad alignment tolerance ranges, supporting the use of a fiber array for the packaging. We anticipate that the proposed approach will be able to be used in commercialized systems and other photonic integrated circuit platforms, including those made from lithium niobate and silicon nitride.
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