4.5 Article

Integration of Thick-Film Permanent Magnets for MEMS Applications

期刊

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
卷 25, 期 4, 页码 716-724

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JMEMS.2016.2574958

关键词

Microelectromechanical systems (MEMS); integration; magnetic powders; bonded permanent magnets; Parylene

资金

  1. European Union [604360]
  2. Enterprise Ireland's Innovation Partnership Programme and Analog Devices [IP 2013/0213]
  3. Ministerio de Economia y Competitividad [MAT2014-56955-R]
  4. (M.ERA-NET Call): New Exchange-Coupled Manganese-Based Magnetic Materials Project [PCIN-2015-126]
  5. M.ERA-NET Programme
  6. Regional Government Comunidad de Madrid through Project Nuevas Fronteras del Nanomagnetismo Fundamental y Aplicado [S2013/MIT-2850]

向作者/读者索取更多资源

This paper presents a method of integrating thick permanent magnetic films into a microfabrication process. An enhanced bindingmethod consisting of a hybrid of Parylene N and Parylene C thin films was used in conjunction with various types of NdFeB powders to create embedded permanent magnet films. A systematic study of composite magnetic powders was developed using three different powders in order to control intrinsic coercivities (H-ci) and remanence (B-r) properties. In addition, four types of dispensing methods were investigated. A liquid dispensing method demonstrated the highest fill factor (79%) for a 400-mu m-thick film with an enhanced remanence value of 0.59 T. A range of remanence values from 0.2 to 0.59 T were developed by varying the concentration of multiple magnetic powders within the composite material. Validation of the integrated magnetic material into a microelectromechanical system device was demonstrated through a polymer on a silicon cantilever structure. [2016-0073]

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