期刊
MATERIALS TODAY PHYSICS
卷 28, 期 -, 页码 -出版社
ELSEVIER
DOI: 10.1016/j.mtphys.2022.100858
关键词
Thermoelectric; Chemical bonding; Lattice thermal conductivity; Thermal stability; Young ?s modulus
资金
- Alexander von Humboldt Foundation
- Youth Innovation Promotion Association of the Chinese Academy of Sciences [Y202041]
Chemical bonding stiffening plays a crucial role in improving the reliability of thermoelectric materials for practical applications by reducing lattice thermal conductivity and enhancing mechanical properties.
It is currently widely accepted that chemical bonding in a thermoelectric material should be weakened as much as possible to obtain a lower lattice thermal conductivity and thus a higher thermoelectric figure of merit, zT, but the consequent reliability issues, such as inferior structural stability and mechanical brittleness, are rarely emphasized. Here, experimental studies on p-type YbMg2Bi2-based compounds demonstrate the advantageous effects of chemical bonding stiffening toward practical applications. Despite the stronger chemical bonding in Sballoyed YbMg2Bi2, the compound still exhibits lower lattice thermal conductivity than its parent YbMg2Bi2 compound, as well as a comparable average zT, due to rigorous point defect scattering. More importantly, chemical bonding toughening guarantees better maintenance of thermoelectric performance under high temperatures and improved mechanical properties, both of which are essential for the durable operation of thermoelectric generators. This research provides a new way of thinking about chemical bonding engineering toward practical thermoelectric applications.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据