期刊
ELECTRONICS
卷 11, 期 18, 页码 -出版社
MDPI
DOI: 10.3390/electronics11182848
关键词
equivalent circuit; improving scanning; TEM waveguide unit-cell; 3D all-metal
资金
- European Union through the European Regional Development Fund (ERDF)
- french region of Brittany
- Conseil Departemental 35 through the CPER Project SOPHIE/STIC Ondes
- Ministry of Higher Education and Research
- Thales Alenia Space
- Region Bretagne
- Rennes Metropole
This publication explores the potential of using all-metal 3D printing technologies to create wide-angle impedance matching layers and proposes a design methodology using all-metal 3D unit-cell topology. Simulation tests show that this method can improve performance by 5 dB within a certain range of angles.
All-metal 3D printing technologies are allowing the conception of new structures for different applications. This publication explores the potential of employing for the first time an all-metal 3D unit-cell topology to perform wide-angle impedance matching layers. A new equivalent circuit is derived for the oblique incidence, providing a good estimation of the cell response for the scanning range (theta = [0 degrees, 55 degrees]) in the main scanning planes for a linearly polarized radiated field. This analytical model is later used to develop a wide-angle impedance matching design methodology for a generic antenna. This methodology is tested in practice to match a phased array made of metallic horns at 18 GHz. An improvement of 5 dB is obtained in the simulations for angles theta > 35 degrees for the H -plane.
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