4.6 Article

Methodology for Improving Scanning Performance Loading an Array Element with a 3D All-Metal WAIM

期刊

ELECTRONICS
卷 11, 期 18, 页码 -

出版社

MDPI
DOI: 10.3390/electronics11182848

关键词

equivalent circuit; improving scanning; TEM waveguide unit-cell; 3D all-metal

资金

  1. European Union through the European Regional Development Fund (ERDF)
  2. french region of Brittany
  3. Conseil Departemental 35 through the CPER Project SOPHIE/STIC Ondes
  4. Ministry of Higher Education and Research
  5. Thales Alenia Space
  6. Region Bretagne
  7. Rennes Metropole

向作者/读者索取更多资源

This publication explores the potential of using all-metal 3D printing technologies to create wide-angle impedance matching layers and proposes a design methodology using all-metal 3D unit-cell topology. Simulation tests show that this method can improve performance by 5 dB within a certain range of angles.
All-metal 3D printing technologies are allowing the conception of new structures for different applications. This publication explores the potential of employing for the first time an all-metal 3D unit-cell topology to perform wide-angle impedance matching layers. A new equivalent circuit is derived for the oblique incidence, providing a good estimation of the cell response for the scanning range (theta = [0 degrees, 55 degrees]) in the main scanning planes for a linearly polarized radiated field. This analytical model is later used to develop a wide-angle impedance matching design methodology for a generic antenna. This methodology is tested in practice to match a phased array made of metallic horns at 18 GHz. An improvement of 5 dB is obtained in the simulations for angles theta > 35 degrees for the H -plane.

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