Mitigation of Thermal Stability Concerns in FinFET Devices

Here, we developed a procedure for mitigating thermal hazards in packaged FinFET devices. A monitoring system was installed into devices, based on self-heating impact analysis in the system and device levels, to allow for the observation and alerting of chip temperature and reliability risks. A novel algorithm for reducing measurement noise by means of temperature fluctuation compensation and the filtering of invalid data is presented and demonstrated on packaged devices. The results presented in this work show that the proposed techniques make exceptional improvements to sensory accuracy. Using this methodology enables the mitigation of thermal concerns in systems, including large data servers, and accelerates development of smart resource allocation formations.

Automated summary

A procedure for mitigating thermal hazards in packaged FinFET devices was developed, which involved the installation of a monitoring system to observe and alert chip temperature and reliability risks. A novel algorithm was also proposed to improve sensory accuracy. This methodology can effectively mitigate thermal concerns in systems.