4.7 Article

Cumulative Hot-Electron Trapping in GaN-Based Power HEMTs Observed by an Ultrafast (10 V/Ns) On-Wafer Methodology

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JESTPE.2021.3077127

关键词

Hard switching; high frequency (100 kHz); hot electrons (10 V/ns); p-type GaN high electron mobility transistor (HEMT); turn-on

资金

  1. Italian Ministry of Education, Universities and Research (MIUR) under the aegis of the Fondo per il finanziamento dei dipartimenti universitari di eccellenza [Law 232/2016]

向作者/读者索取更多资源

The goal of this study is to investigate the impact of hard switching on the dynamic performance of GaN HEMTs. By developing a fast testing system, the researchers found that optimizing the drain node capacitance can accelerate the hard-switching transition. Through experiments at multiple frequencies, it was demonstrated that cumulative turn-on stress has a stronger effect on R-ON compared to off-state stress. By comparing devices with different LCDs, hot electrons were identified as the main mechanism in device degradation. Furthermore, comparing wafers with different processing conditions revealed the significant impact of buffer properties on the dynamic performance of devices in hard switching.
The goal of this article is to advance the understanding of the impact of hard switching on the dynamic performance of GaN-based high electron mobility transistors (HEMTs). To this aim, we developed a fast (10 V/ns) on-wafer system for testing devices in hard switching. The system has been used to study the reliability of several W-G = 2 mm p-type GaN HEMTs with different L-GD or buffer properties. First, we show that by optimizing the drain node capacitance, we can speed up the hard-switching transition to a few ns, even on-wafer level. Second, repeating the experiment by using multiple frequencies, from 1 to 100 kHz, we demonstrate that, in real-world applications, cumulative turn-on stress has a much stronger effect on R-ON compared with oFF-state stress. Third, by comparing the results on identical devices having shorter LCD, we pinpoint hot electrons as the main mechanism in the device degradation, ruling out the contribution of self-heating. Finally, by comparing three wafers with different processing conditions (different passivation, different buffer), we suggest that trapping phenomena related to hot electrons happen in ns time scale and that the properties of the buffer can significantly impact the dynamic performance of the devices in hard switching.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.7
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据