期刊
MATERIALS
卷 15, 期 19, 页码 -出版社
MDPI
DOI: 10.3390/ma15196572
关键词
polybutylene terephthalate; polyamide; picosecond laser; surface activation; palladium distribution; selective metallization
类别
资金
- MID Solution GmbH
The demand for highly integrated and lightweight components has been rising sharply in recent years, specifically in plastics processing. This work presents a three-step laser-based process for subsequent selective metallization, enabling weight-saving solutions and eliminating the need for additional printed circuit boards (PCB) by directly developing conductive tracks on polymer surfaces.
In recent years, the demand for highly integrated and lightweight components has been rising sharply, especially in plastics processing. One strategy for weight-saving solutions is the development of conductive tracks and layouts directly on the polymer housing parts in order to be able to dispense with the system integration of additional printed circuit boards (PCB). This can be conducted very advantageously and flexibly with laser-based processes for functionalizing polymer surfaces. In this work, a three-step laser-based process for subsequent selective metallization is presented. Conventional injection molded components without special additives serve as the initial substrate. The Laser-Based Selective Activation (LSA) uses picosecond laser pulses to activate the plastic surface to subsequently deposit palladium. The focus is on determining the amount of deposited palladium in correlation to the laser and scan parameters. For the first time, the dependence of the metallization result on the accumulated laser fluence (F-acc) is described. The treated polymer parts are characterized using optical and scanning electron microscopy as well as a contact-type profilometer.
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