Tensile Properties of Electrodeposited Nanocrystalline Ni-Cu Alloys

Nanocrystalline Ni-Cu alloys with a Cu content of 6, 10, 19, and 32 wt.% were prepared by pulse electrodeposition. The microstructure and tensile properties of the nanocrystalline Ni-Cu alloys were characterized by x-ray diffraction, transmission electron microscopy, and tensile testing. The x-ray diffraction analysis indicates that the structure of the nanocrystalline Ni-Cu alloys is a face-centered cubic, single-phase solid solution with an average grain size of 18 to 24 nm, and that the average grain size decreased with increasing Cu content. The ultimate tensile strength (similar to 1265 to 1640 MPa) and elongation to failure (similar to 5.8 to 8.9%) of the Ni-Cu alloys increased with increasing Cu content. The increase in tensile strength results from the solid solution and fine-grain strengthening. Elemental Cu addition results in a decrease in stacking fault energy, an increase in work hardening rate, a delay in plasticity instability, and consequently, a higher plasticity.