The study on the welded rate of bonding ZnO rotary target

The industrial grade ZnO ceramic rotary sputtering target was bonded by soldering technology based on indium solder. The scanning electron microscope (SEM) and ultrasonic flaw detection were used to study the influence of process parameters on the welded rate of the target and substrate. The study shows that the metallization of the ceramic inner surface greatly improved the wetting between the solder and ZnO target. In the process of the ultrasonic vibration gradually increasing from 5 KHz to 30 KHz, the welded rate first increased and then decreased, reaching the highest at 30 KHz. By designing the standard tooling, we researched the quantitative characterization of the bonding rate between target and substrate, and finally prepared a ZnO rotary target with a bonding rate greater than 95% and a single defect area of less than 1%.The ZnO film prepared by vacuum magnetron sputtering with bonding target has a uniform microstructure, and the transmittance in the infrared range reaches 97%, which has a very wide application prospect.

Automated summary

This study successfully bonded an industrial grade ZnO ceramic rotary sputtering target using soldering technology, resulting in a high bonding rate and low defect area. The ZnO film prepared by vacuum magnetron sputtering with this bonding target showed excellent transmittance and uniform microstructure.