相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。Atomic simulation of textured silicon carbide surface ultra-precision polishing
Xiaosong Meng et al.
CERAMICS INTERNATIONAL (2022)
Micromechanics of machining and wear in hard and brittle materials
Brian R. Lawn et al.
JOURNAL OF THE AMERICAN CERAMIC SOCIETY (2021)
Science and art of ductile grinding of brittle solids
Han Huang et al.
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE (2021)
Influences of grain size, alloy composition, and temperature on mechanical characteristics of Si100-xGex alloys during indentation process
Van-Trung Pham et al.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2021)
Effect of inclusion on 4H-SiC during nano-scratching from an atomistic perspective
Yuhua Huang et al.
JOURNAL OF PHYSICS-CONDENSED MATTER (2021)
Phase transformation and subsurface damage formation in the ultrafine machining process of a diamond substrate through atomistic simulation
Van-Thuc Nguyen et al.
SCIENTIFIC REPORTS (2021)
Molecular dynamics simulation of ultra-precision machining 3C-SiC assisted by ion implantation
Houfu Dai et al.
JOURNAL OF MANUFACTURING PROCESSES (2021)
Removal behavior of micropipe in 4H-SiC during micromachining
Yuhua Huang et al.
JOURNAL OF MANUFACTURING PROCESSES (2021)
Material removal and interactions between an abrasive and a SiC substrate: A molecular dynamics simulation study
Van-Thuc Nguyen et al.
CERAMICS INTERNATIONAL (2020)
Amorphization-governed elasto-plastic deformation under nanoindentation in cubic (3C) silicon carbide
Liang Zhao et al.
CERAMICS INTERNATIONAL (2020)
Molecular dynamics study of the removal mechanism of SiC in a fixed abrasive polishing in water lubrication
Piao Zhou et al.
CERAMICS INTERNATIONAL (2020)
Evolution of lattice distortions in 4H-SiC wafers with varying doping
Nadeemullah A. Mahadik et al.
SCIENTIFIC REPORTS (2020)
Abrasive mechanisms and interfacial mechanics of amorphous silicon carbide thin films in chemical-mechanical planarization
Van-Thuc Nguyen et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2020)
Molecular dynamics simulation of the material removal in the scratching of 4H-SiC and 6H-SiC substrates
Zige Tian et al.
INTERNATIONAL JOURNAL OF EXTREME MANUFACTURING (2020)
Molecular dynamics simulation of SiC removal mechanism in a fixed abrasive polishing process
Piao Zhou et al.
CERAMICS INTERNATIONAL (2019)
A Nanomechanical Analysis of Deformation Characteristics of 6H-SiC Using an Indenter and Abrasives in Different Fixed Methods
Jisheng Pan et al.
MICROMACHINES (2019)
Study on nanomechanical properties of 4H-SiC and 6H-SiC by molecular dynamics simulations
Zige Tian et al.
CERAMICS INTERNATIONAL (2019)
Nanoscratch of aluminum in dry, water and aqueous H2O2 conditions
Yongguang Wang et al.
APPLIED SURFACE SCIENCE (2019)
A study of deformation behavior and phase transformation in 4H-SiC during nanoindentation process via molecular dynamics simulation
Bo Zhu et al.
CERAMICS INTERNATIONAL (2019)
Subsurface damages beneath fracture pits of reaction-bonded silicon carbide after ultra-precision grinding
Zhipeng Li et al.
APPLIED SURFACE SCIENCE (2018)
Atomistic scale nanoscratching behavior of monocrystalline Cu influenced by water film in CMP process
Junqin Shi et al.
APPLIED SURFACE SCIENCE (2018)
Investigation of Nanocutting Characteristics of Off-Axis 4H-SiC Substrate by Molecular Dynamics
Miaocao Wang et al.
APPLIED SCIENCES-BASEL (2018)
Water film facilitating plastic deformation of Cu thin film under different nanoindentation modes: A molecular dynamics study
Junqin Shi et al.
MATERIALS CHEMISTRY AND PHYSICS (2017)
A numerical study of ultraprecision machining of monocrystalline silicon with laser nano-structured diamond tools by atomistic simulation
Houfu Dai et al.
APPLIED SURFACE SCIENCE (2017)
Solution Growth on Concave Surface of 4H-SiC Crystal
Hironori Daikoku et al.
CRYSTAL GROWTH & DESIGN (2016)
Effects of Water on Tribochemical Wear of Silicon Oxide Interface: Molecular Dynamics (MD) Study with Reactive Force Field (ReaxFF)
Jejoon Yeon et al.
LANGMUIR (2016)
Molecular dynamics simulation study of deformation mechanisms in 3C-SiC during nanometric cutting at elevated temperatures
Saeed Zare Chavoshi et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2016)
Effect of water film on the plastic deformation of monocrystalline copper
Junqin Shi et al.
RSC ADVANCES (2016)
Molecular dynamics study on the mechanism of AFM-based nanoscratching process with water-layer lubrication
Jiaqi Ren et al.
APPLIED SURFACE SCIENCE (2015)
The effect of rough surface on nanoscale high speed grinding by a molecular dynamics simulation
Jia Li et al.
COMPUTATIONAL MATERIALS SCIENCE (2015)
Competition between surface modification and abrasive polishing: a method of controlling the surface atomic structure of 4H-SiC (0001)
Hui Deng et al.
SCIENTIFIC REPORTS (2015)
Nanoscale friction and wear properties of silicon wafer under different lubrication conditions
Xiaochun Chen et al.
APPLIED SURFACE SCIENCE (2013)
Effects of water molecules on tribological behavior and property measurements in nano-indentation processes - a numerical analysis
Yachao Wang et al.
NANOSCALE RESEARCH LETTERS (2013)
Modeling the effects of particle deformation in chemical mechanical polishing
Xiaochun Chen et al.
APPLIED SURFACE SCIENCE (2012)
A quantitative assessment of nanometric machinability of major polytypes of single crystal silicon carbide
Xichun Luo et al.
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY (2012)
Visualization and analysis of atomistic simulation data with OVITO-the Open Visualization Tool
Alexander Stukowski
MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING (2010)
Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation
M. B. Cai et al.
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2007)
Analytical potential for atomistic simulations of silicon, carbon, and silicon carbide
P Erhart et al.
PHYSICAL REVIEW B (2005)
A molecular dynamics analysis of the mechanical effect of water on the deformation of silicon monocrystals subjected to nano-indentation
CY Tang et al.
NANOTECHNOLOGY (2005)
Development of an improved four-site water model for biomolecular simulations: TIP4P-Ew
HW Horn et al.
JOURNAL OF CHEMICAL PHYSICS (2004)