Effect of water film on the nano-scratching process of 4H-SiC under the constant load

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CERAMICS INTERNATIONAL (2022)

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Micromechanics of machining and wear in hard and brittle materials

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Summary: Hard and brittle solids with covalent/ionic bonding are widely used in modern manufacturing technologies, and optimizing shaping processes can reduce manufacturing time and cost while extending component longevity. However, the same processes can also contribute to wear and fatigue degradation in service. Education development of advanced finishing protocols for this class of solids requires a comprehensive understanding of damage mechanisms at small-scale contacts from a materials perspective. The role of microstructure in material removal modes is highlighted, and pathways to future research—experimental, analytical, and computational—are indicated.

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Article Engineering, Manufacturing

Removal behavior of micropipe in 4H-SiC during micromachining

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Summary: Silicon carbide is a good semiconductor material due to its performance in high-voltage and high-frequency fields, but defects like micropipe can impact device performance. Research shows that adjusting penetration depth during micromachining may not completely eliminate the effect of micropipe, but different dynamic behaviors of 4H-SiC under various penetration depths could be a strategy for detecting or controlling the impact of micropipe.

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CERAMICS INTERNATIONAL (2020)

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Molecular dynamics study of the removal mechanism of SiC in a fixed abrasive polishing in water lubrication

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Molecular dynamics simulation of the material removal in the scratching of 4H-SiC and 6H-SiC substrates

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Molecular dynamics simulation of SiC removal mechanism in a fixed abrasive polishing process

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CERAMICS INTERNATIONAL (2019)

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CERAMICS INTERNATIONAL (2019)

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Subsurface damages beneath fracture pits of reaction-bonded silicon carbide after ultra-precision grinding

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Atomistic scale nanoscratching behavior of monocrystalline Cu influenced by water film in CMP process

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Solution Growth on Concave Surface of 4H-SiC Crystal

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Effects of Water on Tribochemical Wear of Silicon Oxide Interface: Molecular Dynamics (MD) Study with Reactive Force Field (ReaxFF)

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Competition between surface modification and abrasive polishing: a method of controlling the surface atomic structure of 4H-SiC (0001)

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Nanoscale friction and wear properties of silicon wafer under different lubrication conditions

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Effects of water molecules on tribological behavior and property measurements in nano-indentation processes - a numerical analysis

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Effect of water film on the nano-scratching process of 4H-SiC under the constant load

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