4.8 Article

Tough Bonding of Liquid Metal-Elastomer Composites for Multifunctional Adhesives

期刊

SMALL
卷 18, 期 41, 页码 -

出版社

WILEY-V C H VERLAG GMBH
DOI: 10.1002/smll.202203700

关键词

adhesion; liquid metals; soft composites; soft robotics; stretchable electronics

资金

  1. Office of Naval Research Young Investigator Program (YIP) [N000142112699]
  2. Defense Advanced Research Projects Agency Young Faculty Award (DARPA YFA) [D18AP00041]
  3. Institute for Critical Technology and Applied Science (ICTAS) at Virginia Tech
  4. Virginia Tech National Center for Earth and Environmental Nanotechnology Infrastructure, a member of the National Nanotechnology Coordinated Infrastructure (NNCI) by NSF [ECCS 1542100, ECCS 2025151]
  5. U.S. Department of Defense (DOD) [N000142112699] Funding Source: U.S. Department of Defense (DOD)

向作者/读者索取更多资源

This study presents a chemical anchoring methodology to increase adhesion of liquid metal composites to diverse substrates. The microstructure of the composites can be controlled to tune fracture energy, tensile modulus, and thermal conductivity. The bonding technique allows for integration of the composites with functional electronic components, enabling extreme deformations while maintaining exceptional thermal and electrical conductivity.
Liquid metal (LM) composites, which consist of LM droplets dispersed in highly deformable elastomers, have recently gained interest as a multifunctional material for soft robotics and electronics. The incorporation of LM into elastic solids allows for unique combinations of material properties such as high stretchability with thermal and electrical conductivity comparable to metals. However, it is currently a challenge to incorporate LM composites into integrated systems consisting of diverse materials and components due to a lack of adhesion control. Here, a chemical anchoring methodology to increase adhesion of LM composites to diverse substrates is presented. The fracture energy increases up to 100x relative to untreated surfaces, with values reaching up to 7800 J m(-2). Furthermore, the fracture energy, tensile modulus, and thermal conductivity can be tuned together by controlling the microstructure of LM composites. Finally, the bonding technique is used to integrate LM composites with functional electronic components without encapsulation or clamping, allowing for extreme deformations while maintaining exceptional thermal and electrical conductivity. These findings can accelerate the adoption of LM composites into complex soft robotic and electronic systems where strong, reliable bonding between diverse materials and components is required.

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