Mechanical properties of hexagonal silicon

Hexagonal silicon (Si-IV) has recently attracted considerable research interest due to its extraordinary optical properties and possibility to convert into a direct semiconductor under strain with great potential for applications. However, the mechanical properties of Si-IV, which are critical for its applications, have not been experimentally studied yet. In this study, combining nanoindentation and in situ high-pressure synchrotron X-ray diffraction, we thoroughly investigated the mechanical properties of Si-IV. The results suggest that the elastic moduli and hardness of Si-IV are close to those of the common diamond cubic silicon. The similar mechanical properties of Si-IV and diamond cubic silicon are beneficial for integrating Si-IV into conventional Si-based devices using similar industrial processing and for its photovoltaic and optoelectronic applications.

Automated summary

The mechanical properties of hexagonal silicon (Si-IV) were experimentally studied, revealing that Si-IV has similar elastic modulus and hardness to the common diamond cubic silicon. This similarity enables the integration of Si-IV into conventional Si-based devices and its potential for photovoltaic and optoelectronic applications.