An investigation on application potentiality of microstructure heat sinks with different flow topological morphology

Microstructure heat sinks have great potential for high heat flux cooling. In this paper, we compared microchannel (MC), micro-pin-fin (MPF), manifold microchannel (MMC), and manifold micro-pin-fin (MMPF) heat sinks to figure out the pros and cons. Fluid flow and manifold unit models are used to study thermal and hydrodynamic performance. The heat sinks with different channel/fin sizes, manifold numbers, and porosities are discussed according to the pressure drop, temperature, thermal resistance, and coefficient of performance. Results show that MMC and MMPF heat sinks are superior to MC and MPF heat sinks, and there are also differences between MMC and MMPF heat sinks. Typically, the MMPF heat sink has lower maximum temperature, temperature non-uniformity, and total thermal resistance R-tot. In contrast, the MMC heat sink has a lower pressure drop and higher COP. For the MMPF heat sink, at the nozzle width of 6.75 mu m and the MPF width of 70.71 mu m (porosity = 0.167), it achieves the lowest total thermal resistance of R-tot = 2.97 x 10(-6) K m(2)/W. Under 10(3) W/cm(2) heat flux, the maximum surface temperature rise is 29.74 K, and the maximum temperature difference of the heating surface is 3.15 K. This research initially provides a clear reference on the selection of single-phase cooling microstructures for ultra high heat flux dissipation.

Automated summary

This paper compares the pros and cons of microstructure heat sinks, including microchannel, micro-pin-fin, manifold microchannel, and manifold micro-pin-fin heat sinks. The results show that manifold microchannel and manifold micro-pin-fin heat sinks are superior to microchannel and micro-pin-fin heat sinks. The manifold micro-pin-fin heat sink has lower maximum temperature and thermal resistance, while the manifold microchannel heat sink has lower pressure drop and higher coefficient of performance.