Impact of the Channel Thickness on Electron Confinement in MOCVD-Grown High Breakdown Buffer-Free AlGaN/GaN Heterostructures

The 2D electron gas (2DEG) confinement on high electron mobility transistor (HEMT) heterostructures with a thin undoped GaN channel layer on the top of a grain-boundary-free AlN nucleation layer is studied. This is the first time demonstration of a buffer-free epi-structure grown with metal-organic chemical vapor deposition with thin GaN channel thicknesses, ranging from 250 to 150 nm, without any degradation of the structural quality and 2DEG properties. The HEMTs with a gate length of 70 nm exhibit good DC characteristics with peak transconductances of 500 mS mm(-1) and maximum saturated drain currents above 1 A mm(-1). A thinner GaN channel layer improves 2DEG confinement because of the enhanced effectiveness of the AlN nucleation layer acting as a back-barrier. An excellent drain-induced barrier lowering of only 20 mV V-1 at a V-DS of 25 V and an outstanding critical electric field of 0.95 MV cm(-1) are demonstrated. Good large-signal performance at 28 GHz with output power levels of 2.0 and 3.2 W mm(-1) and associated power-added efficiencies of 56% and 40% are obtained at a V-DS of 15 and 25 V, respectively. These results demonstrate the potential of sub-100 nm gate length HEMTs on a buffer-free GaN-on-SiC heterostructure.

Automated summary

This study demonstrates the potential of sub-100 nm gate length HEMTs on a buffer-free GaN-on-SiC heterostructure, where a thin GaN channel layer is used on top of a grain-boundary-free AlN nucleation layer for 2D electron gas confinement. The results show no degradation of the structural quality and 2DEG properties, indicating the promising performance of these devices.