期刊
JOURNAL OF LIGHTWAVE TECHNOLOGY
卷 34, 期 2, 页码 286-295出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JLT.2015.2481602
关键词
Optical transceivers; optical communications; silicon photonics
Industrial implementation of a silicon photonics platform using 300-mm SOI wafers and aiming at 100 Gb/s aggregate data-rate application is demonstrated. The integration strategy of electronic and photonic ICs, 300-mm process flow, and process variability are discussed, and performances of the passive and active optical devices are shown. An example of a low-cost LGA-based package together with a fiber assembly is given. RX and TX circuits operating at 25 Gb/s are demonstrated. Finally, the process evolution toward the integration of the backside reflector and multiple silicon etching level is demonstrated.
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