期刊
JOURNAL OF LIGHTWAVE TECHNOLOGY
卷 34, 期 9, 页码 2139-2144出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JLT.2016.2520826
关键词
Bonding processes; optical device fabrication; optical receivers; optoelectronic devices; photodiodes
资金
- DARPA
- AFRL
Back-illuminated flip-chip-bonded charge-compens ated modified uni-traveling-carrier photodiodes (PDs) with bandwidths in excess of 110 GHz are demonstrated. PDs with 10- and 6-mu m-diameters deliver RF output power levels as high as 9.6 dBm at 100 GHz and 7.8 dBm at 110 GHz, respectively. An analytical model based on parameter extraction from S-parameter fitting was used to assess the bandwidth limiting factors.
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