4.7 Article

Deformation measurement in Al thin films at elevated temperatures by digital image correlation with speckles prepared by femtosecond laser

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High-temperature digital image correlation techniques for full-field strain and crack length measurement on ceramics at 1200°C: Optimization of speckle pattern and uncertainty assessment

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Summary: This study focuses on high-temperature mechanical tests coupled with Digital Image Correlation (DIC) on ceramics, addressing challenges such as thermal resistance of the speckle pattern and black body radiation. An experimental procedure was specifically designed to minimize disturbances and select a suitable speckle pattern for mechanical characterization at 1200 degrees C. Results show that a speckle pattern with fine silicon carbide powder provides the best representation of crack progression during fracture behavior analysis, revealing more crack branching at high temperatures compared to room temperature.

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