Use of plasma oxidation for conversion of metal salt infiltrated thin polymer films to metal oxide

Oxygen plasma treatments for conversion of metal salt infiltrated polymer films to metal oxide films using an asymmetrical capacitively coupled plasma system were investigated. Hydroxylated Poly-2-Vinylpyridine (P2VP-OH) thin films grafted to silicon were exposed to metal salt-solvent solutions which swell the polymer enabling metal ion infiltration. Exposing the resulting film to oxygen plasma resulted in formation of polymer-free metal oxide films. Atomic oxygen and positive ions present in plasma can both influence the process outcome. A design of experiment approach was used to investigate the impact of radio frequency (RF) power, gas pressure and process time on plasma composition and the resulting metal oxide films. A combination of Langmuir probe, retarding field energy analyser and optical emission spectroscopy measurements were used to monitor the plasma. The samples surfaces were examined using x-ray photoelectron spectroscopy, ellipsometry, transmission electron microscopy and energy dispersive x-ray analysis. Gas pressure and RF power were found to strongly influence both ion energy, and atomic oxygen to molecular ion ratios [O]/[O-2 (+)] in the plasma which impacted the resulting surface layer. For the plasma conditions investigated conversion to a metal oxide was achieved in minutes. Sputter contamination was found to be significant in some cases.

Automated summary

This study investigates the conversion of metal salt infiltrated polymer films to metal oxide films using oxygen plasma treatments in an asymmetrical capacitively coupled plasma system. The impact of radio frequency power, gas pressure, and process time on plasma composition and resulting metal oxide films is examined. Various measurement techniques are used to monitor the plasma and analyze the sample surfaces. Gas pressure and RF power are found to significantly influence ion energy and the ratio of atomic oxygen to molecular ions in the plasma, which affect the formation of the surface layer.