The effect of hydrophilic and hydrophobic surfaces on the thermal and atomic behavior of ammonia/copper nanofluid using molecular dynamics simulation

The formation of hydrophilic (HPI) and hydrophobic (HPO) surfaces on the walls of simulated aluminum nanochannels (NC) directly affects the thermal behavior and atomic behavior of nanofluid (NF) flows. In the present study, the thermal behavior and atomic behavior of ammonia/Cu NF in an aluminum NC with the walls that covered with HPI (TiO2) surface, HPO surface (Carboxylic acid), and a combination of these two atomic structures were studied using molecular dynamics simulation (MDS). The quantities of phase change time (PCT), aggregation time (AT) of nanoparticles (NPs), and thermal conductivity (TC) are stud-ied to examine the atomic behavior and thermal behavior of structures. The simulated structure has a higher density (D) in the presence of HPI surface than HPO surface and combined surfaces. Also, using HPI surfaces on the inner surface of aluminum NCs, condensed particles were reduced to 71 % in 2.83 ns, which shows the highest percentage of phase-changed particles in the shortest time. Also, the HPI surface leads to an increase in the TC and AT. According to this simulation, the presence of HPI sur-faces improves the thermal behavior of ammonia/Cu NF.(c) 2022 Elsevier B.V. All rights reserved.

Automated summary

This study investigates the thermal and atomic behavior of ammonia/copper nanofluid in aluminum nanochannels with different surface coatings. The results show that hydrophilic surfaces improve the thermal behavior and reduce the phase change time of the nanofluid.