期刊
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
卷 121, 期 -, 页码 52-66出版社
JOURNAL MATER SCI TECHNOL
DOI: 10.1016/j.jmst.2021.11.064
关键词
Fuse filament fabrication; Conductive polymers; Nanocomposites; Mechanical properties; Creep behavior; Resistivity
This paper reports on a comparative study of the effects of two types of carbon nanotubes on the properties of 3D-printed parts. The study found that the tensile properties and softening temperature of the 3D-printed parts were enhanced with increasing carbon nanotube content. Single-wall carbon nanotubes and multiwall carbon nanotubes had different effects on the properties of the 3D-printed parts, but both could be used for the production and application of thermoelectric devices and flexible circuits.
The following paper reports on a comparative study of the effects of two types of carbon nanotubes, namely multiwall (MWCNT) and single-wall (SWCNT) carbon nanotube, on the properties of 3D-printed parts produced with acrylonitrile-butadiene-styrene (ABS) nanocomposites with various CNT loadings of 5-10 wt.%. Quasi-static tensile properties and Vicat softening temperature of 3D-printed parts were enhanced with the increasing CNT content. The highest enhancement in tensile properties was observed for the ABS/CNT nanocomposites at 10 wt.% filler loading. 3D-printed ABS/SWCNT composites showed higher tensile modulus, better creep stability and higher Vicat temperature. However, the strength of ABS/SWCNT 3D samples is relatively lower than that of ABS/MWCNT. In addition, 3D-printed parts exhibited anisotropic electrical conductive behaviour, which has a conductivity of through-layer of about 2-3 orders of magnitude higher than cross-layer. The highest conductivity of 3D-printed samples reached 25.2 S/m, and 9.3 S/m for ABS/MWCNT and ABS/SWCNT composites at 10 wt.%, respectively. The results obtained, i.e. the successful fuse filament fabrication and the consequent electromechanical properties, confirm that these 3D printable nanocomposite could be properly utilized for the production, and application up to about 90 degrees C, of thermoelectric devices and/or resistors for flexible circuits. (c) 2022 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.
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