Ultra-low-permittivity, high hydrophobic, and excellent thermally stable fluoroelastomer/polyimide composite films employing dielectric reduction

Dielectric materials with low permittivity are urgently needed in the field of microelectronics due to the development of integration and miniaturization of integrated circuits. In this work, a series of all-organic polyimide (PI) films with ultra-low-permittivity and high hydrophobicity were successfully synthesized by introducing a kind of fluoroelastomer (FEM). And the significant permittivity reduction phenomenon was discussed through molecular dynamics simulations and practical tests. It was assumed that the hydrogen bond significantly inhibited the dipolar polarization of the FEM/PI composite system, which played an important role in deter-mining the dielectric properties of FEM/PI composite films. At a low filler content of 7 wt%, FEM/PI composites exhibited the optimum permittivity (epsilon) of 1.21 at 106 Hz, which was the lowest permittivity of the PI films, while a low water absorption of 0.44 % and high thermal stability with a 10 % decomposition temperature (Td10%) of 548 C were also observed. This simple and effective strategy of fabricating ultra-low-permittivity PI film is a potential way to realize commercial process.

Automated summary

This study successfully synthesized all-organic polyimide (PI) films with ultra-low permittivity and high hydrophobicity by introducing a fluoroelastomer (FEM). The impact of the fluoroelastomer on the dielectric properties was studied through molecular dynamics simulations and practical tests.