4.5 Review

Recent advances and challenges in temperature monitoring and control in microfluidic devices

期刊

ELECTROPHORESIS
卷 44, 期 1-2, 页码 268-297

出版社

WILEY
DOI: 10.1002/elps.202200162

关键词

heating; lab-on-a-chip; microfluidics; sensors; temperature

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Temperature is a critical parameter in microfluidics that is sometimes overlooked. This review discusses different techniques for measuring and controlling temperature in microfluidic devices, including thermocouples, thermistors, and custom-built temperature sensors. The temperature control methods can be classified as external or integrated. Additionally, the potential integration of microfluidic platforms with the Internet of Things technology is explored as a potential new trend.
Temperature is a critical-yet sometimes overlooked-parameter in microfluidics. Microfluidic devices can experience heating inside their channels during operation due to underlying physicochemical phenomena occurring therein. Such heating, whether required or not, must be monitored to ensure adequate device operation. Therefore, different techniques have been developed to measure and control temperature in microfluidic devices. In this contribution, the operating principles and applications of these techniques are reviewed. Temperature-monitoring instruments revised herein include thermocouples, thermistors, and custom-built temperature sensors. Of these, thermocouples exhibit the widest operating range; thermistors feature the highest accuracy; and custom-built temperature sensors demonstrate the best transduction. On the other hand, temperature control methods can be classified as external- or integrated-methods. Within the external methods, microheaters are shown to be the most adequate when working with biological samples, whereas Peltier elements are most useful in applications that require the development of temperature gradients. In contrast, integrated methods are based on chemical and physical properties, structural arrangements, which are characterized by their low fabrication cost and a wide range of applications. The potential integration of these platforms with the Internet of Things technology is discussed as a potential new trend in the field.

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